威廉J. 手掌,Ph值.D., P.E.
专业领域
Mechanical 工程教育
Ph.D., Mechanical 工程, Massachusetts Institute of Technology; M.S., Mechanical 工程, University of California at Berkeley; B.S., Mechanical 工程, Pennsylvania State University
William 棕榈 is Professor of 工程 and Director of the University Honors Program. Prior to joining Roger Williams University he worked as a product design engineer and consultant, performing human-centered design and engineering analysis for a range of consumer, 医疗, and industrial products. He is a licensed Professional Engineer in the Commonwealth of Massachusetts and a named inventor on nine patents.
Dr. 棕榈’s research interests include new product development and engineering student success. He is co-principal investigator on the National Science Foundation-sponsored RISE Scholars Program, and has mentored a variety of undergraduate research projects on 医疗 devices, 辅助技术, 个人流动性.
He has taught ENGR 110 – 工程 Graphics and Design, ENGR 115 – Computer Applications for 工程, ENGR 310 – Materials Science, ENGR 332 – Machine Design, ENGR 430 – Medical Device Design, ENGR 432 – Manufacturing and Assembly, ENGR 442 – Biomechanics, ENGR 490/492 – 工程 Design I & II, HONR 100 – Foundations of Honors, and HONR 400 – Honors Capstone Seminar.
Additional information is available at Dr. 棕榈’s personal webpage.